DEVELOPMENT OF MORINGA OLEIFERA FRUIT POD MICROPARTICLES REINFORCED EPOXY COMPOSITES FOR ENGINEERING APPLICATION

Abstract

Natural fiber reinforced bio-composites are playing a vital role in the polymer industry due to their low cost, light weight, renewability, biodegradability and eco-friendly properties. The effects of particulate Moringa Oleifera fruit pod (MOFP) on the selected properties of MOFP reinforced epoxy bio-composites was studied in order to ascertain its possible application in engineering. The fruit pod was divided into two and further processed as calcined and pulverized fruit pod particulate. The bio-composites were developed using the hand lay-up method by mixing the selected materials in predetermined proportions. SEM/EDS of the MOFP particulates were characterized while mechanical (tensile, flexural and impact), wear, thermal and water absorption properties of the developed bio-composites were evaluated. The results showed that the pulverized MOFP reinforced epoxy bio-composites showed improved properties than the calcined MOFP bio-composites in most of the tests performed. Also, it was observed that most of the tests gave the best results at different weight fractions. However, 15 wt.% emerged as the weight fraction with optimum values. It was discovered that 15 wt.% pulverized MOFP reinforced epoxy bio-composites gave about 28.7% and 8.8% enhancement and with a value of 39.02 MPa and 753.28 MPa in flexural strength and tensile modulus, respectively, and 3 wt. % calcined emerged as the optimum weight fraction for the wear index with 71.25% enhancement and a value of 0.32 mg while 9 wt. % calcined MOFP gave about 50% enhancement and a value of 0.155 W/mK in thermal conductivity. Hence, addition of 3-15 wt.% MOFP micro particles into epoxy produces the optimum compositions for epoxy bio-composites with improved properties. Based on the findings, MOFP epoxy composites can be used in packaging and in electrical applications such as circuit boards and cables due to their low thermal conductivity.